XCVC1902-2LLIVSVA2197
XCVC1902-2LLIVSVA2197
Part number:
122-XCVC1902-2LLIVSVA2197-ND
Product_Category
System On Chip (SoC)
Manufacturer
Xilinx (AMD)
Type
IC VERSAL AICOR
Encapsulation
Package
Tray
RoHS:
NO
Quantity
200
$4,283.7000
Minimun: 1
multiples: 1
Quantity
Price
Total
1
$4,283.7000
$4,283.7000
XCVC1902-2LLIVSVA2197 NEWS
Specifications
PDF1
TYPEDESCRIPTION
MfrXilinx (AMD)
SeriesVersal™ AI Core
PackageTray
Product StatusACTIVE
Package / Case2197-BFBGA, FCBGA
Speed450MHz, 1.08GHz
RAM Size256KB
Operating Temperature-40°C ~ 100°C (TJ)
Core ProcessorDual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary AttributesVersal™ AI Core FPGA, 1.9M Logic Cells
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDDR, DMA, PCIe
Supplier Device Package2197-FCBGA (45x45)
ArchitectureMPU, FPGA