XCVC1502-2LSENSVG1369
XCVC1502-2LSENSVG1369
Part number:
122-XCVC1502-2LSENSVG1369-ND
Product_Category
System On Chip (SoC)
Manufacturer
Xilinx (AMD)
Type
IC VERSAL AI-CO
Encapsulation
Package
Tray
RoHS:
NO
Quantity
200
$1,664.2000
Minimun: 1
multiples: 1
Quantity
Price
Total
1
$1,664.2000
$1,664.2000
XCVC1502-2LSENSVG1369 NEWS
Specifications
PDF1
TYPEDESCRIPTION
MfrXilinx (AMD)
SeriesVersal™ AI Core
PackageTray
Product StatusACTIVE
Package / Case1369-BFBGA, FCBGA
Speed450MHz, 1.08GHz
Number of I/O500
Operating Temperature0°C ~ 100°C (TJ)
Core ProcessorDual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary AttributesVersal™ AI Core FPGA, 800k Logic Cells
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDDR, DMA, PCIe
Supplier Device Package1369-FCBGA (35x35)
ArchitectureMPU, FPGA