| TYPE | DESCRIPTION |
| Mfr | Canfield Technologies |
| Series | - |
| Package | Spool |
| Product Status | ACTIVE |
| Diameter | 0.020" (0.51mm) |
| Wire Gauge | 24 AWG, 25 SWG |
| Composition | BLF 227 (99.17Sn/.8Cu/.03Ni) |
| Type | Wire Solder |
| Melting Point | 440°F (227°C) |
| Form | Spool, 1 lb (453.59g) |
| Process | Lead Free |
| Flux Type | Rosin Activated (RA) |
| Storage/Refrigeration Temperature | 50°F ~ 104°F (10°C ~ 40°C) |
| Shelf Life Start | Date of Manufacture |
| Shelf Life | 24 Months |
Taoxin Chuangke HK Electronic Technology Limited
2901, Block A, Electronic Technology Building, Shennan Middle Road, Futian District, Shenzhen
Jasonzhang@taochip.net.cn
0755-82715986
